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PHB47NQ10T
N-channel TrenchMOS standard level FET
Rev. 02 -- 25 February 2010 Product data sheet
1. Product profile
1.1 General description
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only.
1.2 Features and benefits
Low conduction losses due to low on-state resistance Suitable for high frequency applications due to fast switching characteristics
1.3 Applications
DC-to-DC convertors Switched-mode power supplies
1.4 Quick reference data
Table 1. VDS ID Ptot Quick reference Conditions Tmb = 25 C; VGS = 10 V; see Figure 1 and 2 Tmb = 25 C; see Figure 3 Min Typ Max 100 47 166 Unit V A W drain-source voltage Tj 25 C; Tj 175 C drain current total power dissipation gate-drain charge Symbol Parameter
Dynamic characteristics QGD VGS = 10 V; ID = 40 A; VDS = 80 V; Tj = 25 C; see Figure 13 VGS = 10 V; ID = 25 A; Tj = 25 C; see Figure 11 and 12 21 nC
Static characteristics RDSon drain-source on-state resistance 20 28 m
NXP Semiconductors
PHB47NQ10T
N-channel TrenchMOS standard level FET
2. Pinning information
Table 2. Pin 1 2 3 mb Pinning information Symbol G D S D Description gate drain source mounting base; connected to drain
2 1 3
[1]
Simplified outline
mb
Graphic symbol
D
G
mbb076
S
SOT404 (D2PAK)
[1] It is not possible to make a connection to pin 2.
3. Ordering information
Table 3. Ordering information Package Name PHB47NQ10T D2PAK Description plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped) Version SOT404 Type number
PHB47NQ10T_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 25 February 2010
2 of 13
NXP Semiconductors
PHB47NQ10T
N-channel TrenchMOS standard level FET
4. Limiting values
Table 4. Symbol VDS VDGR VGS ID IDM Ptot Tstg Tj IS ISM EDS(AL)S Limiting values Parameter drain-source voltage drain-gate voltage gate-source voltage drain current peak drain current total power dissipation storage temperature junction temperature source current peak source current Tmb = 25 C tp 10 s; pulsed; Tmb = 25 C VGS = 10 V; Tmb = 100 C; see Figure 1 VGS = 10 V; Tmb = 25 C; see Figure 1 and 2 tp 10 s; pulsed; Tmb = 25 C; see Figure 2 Tmb = 25 C; see Figure 3 Conditions Tj 25 C; Tj 175 C Tj 25 C; Tj 175 C; RGS = 20 k Min -20 -55 -55 Max 100 100 20 33 47 187 166 175 175 47 187 45 Unit V V V A A A W C C A A mJ
In accordance with the Absolute Maximum Rating System (IEC 60134).
Source-drain diode
Avalanche ruggedness non-repetitive VGS = 5 V; Tj(init) = 25 C; ID = 30 A; Vsup 25 V; drain-source avalanche unclamped; tp = 0.1 ms; RGS = 50 ; see Figure 4 energy
120 Ider (%) 80
03aa24
103 ID (A) 102 RDSon = VDS / ID tp = 1 s 10 s 100 s
003aaa097
40
10 D.C.
1 ms 10 ms 100 ms
0 0 50 100 150 Tmb (C) 200
1 1 10 102 VDS (V) 103
Fig 1.
Normalized continuous drain current as a function of mounting base temperature
Fig 2.
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
PHB47NQ10T_2
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 25 February 2010
3 of 13
NXP Semiconductors
PHB47NQ10T
N-channel TrenchMOS standard level FET
120 Pder (%) 80
03aa16
102
003aaa098
IAS (A) 25 C 10
40 Tj prior to avalanche = 150 C
0 0 50 100 150 Tmb (C) 200
1
10-3
10-2
10-1
1 tp (ms)
10
Fig 3.
Normalized total power dissipation as a function of mounting base temperature
Fig 4.
Non-repetitive avalanche ruggedness current as a function of pulse duration
5. Thermal characteristics
Table 5. Symbol Rth(j-mb) Thermal characteristics Parameter Conditions Min Typ Max 0.9 Unit K/W thermal resistance from see Figure 5 junction to mounting base thermal resistance from mounted on printed-circuit board; junction to ambient minimum footprint
Rth(j-a)
-
50
-
K/W
1 = Zth (j-mb) (K/W) 10-1 0.5 0.2 0.1 0.05 0.02 10-2 Single pulse P
003aaa099
=
tp T
tp 10-3 T 10-7 10-6 10-5 10-4 10-3 10-2 10-1 1 tp (s)
t
10
Fig 5.
Transient thermal impedance from junction to mounting base as a function of pulse duration
PHB47NQ10T_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 25 February 2010
4 of 13
NXP Semiconductors
PHB47NQ10T
N-channel TrenchMOS standard level FET
6. Characteristics
Table 6. Symbol V(BR)DSS VGS(th) Characteristics Parameter drain-source breakdown voltage gate-source threshold voltage Conditions ID = 250 A; VGS = 0 V; Tj = 25 C ID = 1 mA; VDS = VGS; Tj = 175 C; see Figure 10 ID = 1 mA; VDS = VGS; Tj = 25 C; see Figure 10 IDSS IGSS RDSon drain leakage current gate leakage current drain-source on-state resistance VDS = 100 V; VGS = 0 V; Tj = 25 C VDS = 100 V; VGS = 0 V; Tj = 175 C VGS = 20 V; VDS = 0 V; Tj = 25 C VGS = -20 V; VDS = 0 V; Tj = 25 C VGS = 10 V; ID = 25 A; Tj = 175 C; see Figure 11 and 12 VGS = 10 V; ID = 25 A; Tj = 25 C; see Figure 11 and 12 Dynamic characteristics QG(tot) QGS QGD Ciss Coss Crss td(on) tr td(off) tf VSD trr Qr total gate charge gate-source charge gate-drain charge input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time source-drain voltage reverse recovery time recovered charge IS = 25 A; VGS = 0 V; Tj = 25 C; see Figure 15 IS = 47 A; dIS/dt = -100 A/s; VGS = -10 V; VDS = 30 V; Tj = 25 C VDS = 30 V; RL = 1.2 ; VGS = 10 V; RG(ext) = 10 ; Tj = 25 C VDS = 25 V; VGS = 0 V; f = 1 MHz; Tj = 25 C; see Figure 14 ID = 40 A; VDS = 80 V; VGS = 10 V; Tj = 25 C; see Figure 13 66 12 21 2320 315 187 15 70 83 45 0.85 66 0.24 3100 378 256 23 105 116 63 1.2 nC nC nC pF pF pF ns ns ns ns V ns C Min 100 1 2 Typ 3 0.05 2 2 20 Max 4 10 500 100 100 76 28 Unit V V V A A nA nA m m
Static characteristics
Source-drain diode
PHB47NQ10T_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 25 February 2010
5 of 13
NXP Semiconductors
PHB47NQ10T
N-channel TrenchMOS standard level FET
ID (A)
180 160 140 120 100 80 VGS = 10 V 8.0 V
003aaa100
100 ID (A) 80
003aaa101
20 V
7.5 V 7.0 V
60 6.5 V 6.0 V 60 40 20 0 0 2 4 6 8 10 VDS (V) 5.5 V 20 5.0 V 4.5 V 0 0 2 4 6 VGS (V) 8 Tj = 175 C 25 C 40
Fig 6.
Output characteristics: drain current as a function of drain-source voltage; typical values
003aaa078
Fig 7.
Transfer characteristics: drain current as a function of gate-source voltage; typical values
003aaa104
10-1 ID (A) 10-2
gfs 45 (S) 40 35 30 25
10-3
2%
typ
98%
10-4
20 15
10-5
10 5
10-6
0 0 1 2 3 4 VGS (V) 5 0 20 40 60 80 ID (A) 100
Fig 8.
Sub-threshold drain current as a function of gate-source voltage
Fig 9.
Forward transconductance as a function of drain current; typical values
PHB47NQ10T_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 25 February 2010
6 of 13
NXP Semiconductors
PHB47NQ10T
N-channel TrenchMOS standard level FET
4.5 4 VGS(th) (V) 3.5 3 typ 2.5
003aaa023
65 RDSon 60 (m) 55 50 45 40 VGS = 5.5 V 6.0 V
003aaa102
6.5 V
max
7.0 V 7.5 V
2 1.5 1 0.5 0 -60 -20
min
35 8.0 V 30 25 20 10 V
20
60
100 140 Tj (C)
180
15
5
25
45
65
85
105 125 ID (A)
Fig 10. Gate-source threshold voltage as a function of junction temperature
2.0 a 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -60 -20 20 60 100 140 180 Tj (C)
003aaa103
Fig 11. Drain-source on-state resistance as a function of drain current; typical values
10 VGS (V) 8 VDD = 20 V 6 VDD = 80 V 4
003aaa107
2
0
0
10
20
30
40
50
60 70 QG (nC)
Fig 12. Normalized drain-source on-state resistance factor as a function of junction temperature
Fig 13. Gate-source voltage as a function of gate charge; typical values
PHB47NQ10T_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 25 February 2010
7 of 13
NXP Semiconductors
PHB47NQ10T
N-channel TrenchMOS standard level FET
5 Ciss, Coss, Crss (nF) 4
003aaa105
100 IS (A) 80
003aaa106
Ciss
3
Coss
60
Tj = 175 C 25 C
2
Crss
40
1
20
0 10-2
10-1
1
10 VDS (V)
102
0
0
0.2
0.4
0.6
0.8
1.0
1.2 1.4 VSD (V)
Fig 14. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values
Fig 15. Source current as a function of source-drain voltage; typical values
PHB47NQ10T_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 25 February 2010
8 of 13
NXP Semiconductors
PHB47NQ10T
N-channel TrenchMOS standard level FET
7. Package outline
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)
SOT404
A E A1 mounting base
D1
D
HD
2
Lp
1
3
b c Q
e
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 4.50 4.10 A1 1.40 1.27 b 0.85 0.60 c 0.64 0.46 D max. 11 D1 1.60 1.20 E 10.30 9.70 e 2.54 Lp 2.90 2.10 HD 15.80 14.80 Q 2.60 2.20
OUTLINE VERSION SOT404
REFERENCES IEC JEDEC JEITA
EUROPEAN PROJECTION
ISSUE DATE 05-02-11 06-03-16
Fig 16. Package outline SOT404 (D2PAK)
PHB47NQ10T_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 25 February 2010
9 of 13
NXP Semiconductors
PHB47NQ10T
N-channel TrenchMOS standard level FET
8. Revision history
Table 7. Revision history Release date 20100225 Data sheet status Product data sheet Change notice Supersedes PHP_PHB_47NQ10T-01 Document ID PHB47NQ10T_2 Modifications:
* *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Product data -
PHP_PHB_47NQ10T-01 (9397 750 08243)
20010516
PHB47NQ10T_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 25 February 2010
10 of 13
NXP Semiconductors
PHB47NQ10T
N-channel TrenchMOS standard level FET
9. Legal information
9.1 Data sheet status
Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Document status [1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer's third party customer(s) (hereinafter both referred to as "Application"). It is customer's sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
9.3
Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
PHB47NQ10T_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 25 February 2010
11 of 13
NXP Semiconductors
PHB47NQ10T
N-channel TrenchMOS standard level FET
customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications.
Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products -- Unless the data sheet of an NXP Semiconductors product expressly states that the product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. TrenchMOS -- is a trademark of NXP B.V.
10. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PHB47NQ10T_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 25 February 2010
12 of 13
NXP Semiconductors
PHB47NQ10T
N-channel TrenchMOS standard level FET
11. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Contact information. . . . . . . . . . . . . . . . . . . . . .12
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 February 2010 Document identifier: PHB47NQ10T_2

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